Low Profile Packaging for MEMS Aero-Acoustic Sensors.

Burns, John.


  • Abstract: This thesis explores both a semi-automated conductive ink process and modifications to Draper Laboratory's i-UHD (Integrated - Ultra High Density) process for packaging MEMS devices. These methods are applied to packaging MEMS acoustic sensors for wind tunnel testing. The primary advantage of these methods is a reduction in surface topology between the package and the integrated MEMS ... read more
This object is in collection Creator department Thesis Type Genre Permanent URL
To Cite:
DCA Citation Guide    EndNote