Through-Silicon Via Analysis for the Design of 3-D Integrated Circuits.
Khan, Nauman.
2011
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Abstract: Stacking
multiple dies to form 3-D integrated circuits (ICs) has emerged as a promising
technology to reduce interconnect delay and power, to increase device density, and to
achieve heterogeneous integration. Through-silicon vias (TSVs), metallic wires that
connect different dies, are a key enabling technology for 3-D ICs. TSVs can be used for
routing signals, for power delivery, ... read moreand for heat extraction. TSV-manufacturing advances
are well underway. However, there is little experience in designing optimally with TSVs.
This thesis explores challenges and best design strategies for TSVs, and offers several
key contributions. Signal TSVs induce noise in the substrate and affect neighboring
devices. This thesis proposes a novel technique, GND Plug, to mitigate TSV-induced
noise. The results show the superiority of this technique in grounding noise compared to
other techniques adapted from 2-D planar technologies such as a backside ground plane
and traditional substrate contacts. The thesis also investigates in the form of a
comparative study the impact of TSV size and granularity, spacing of controlled
collapsed chip connections (C4) connectors, off-chip power delivery network, shared and
dedicated TSVs, and coaxial TSVs on the quality of power delivery in 3-D ICs. The thesis
provides detailed "best design" practices for designing 3-D power delivery networks.
TSVs occupy silicon real-estate and impact device density. This thesis provides four
algorithms, in an iterative framework, to minimize the number of TSVs needed for power
delivery network. Unlike prior work, these algorithms can be applied early in the design
stages when only functional block-level behaviors and a floorplan are available.
Finally, the thesis explores using Carbon Nanotubes to design the TSVs and power grid,
and the results show that the use of Carbon Nanotubes for grid design offers substantial
advantages in terms of reducing IR drops. Overall, the thesis advances the state-of-art
in 3-D design.
Thesis (Ph.D.)--Tufts University, 2011.
Submitted to the Dept. of Computer Science.
Advisor: Soha Hassaoun.
Committee: Syed Alam, Valencia Joyner, Samuel Guyer, and Eric Miller.
Keyword: Computer science.read less - ID:
- zp38wq580
- Component ID:
- tufts:20873
- To Cite:
- TARC Citation Guide EndNote
