Low Profile Packaging for MEMS Aero-acoustic Sensors.

Burns, John.

White, Robert D.

Krause, Joshua.

2012.

Description
  • This paper describes a semi-automated conductive ink process used for packaging MEMS devices. The method is applied to packaging of MEMS sensors for wind tunnel testing. The primary advantage of the method is a reduction in surface topology between the package and the integrated MEMS sensors. In this paper we explore the relationship between trace dimensions, resistivity, and deposition parameters... read more
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  • Burns, J., White, R., & Krause, J. (2012). Low Profile Packaging for MEMS Aero-acoustic Sensors. MRS Proceedings, 1415. doi:10.1557/opl.2012.48.
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