Micromachined Lateral Force Sensors for Characterization of Microscale Surface Forces During Chemical Mechanical Polishing.

Gauthier, Douglas.

Mueller, Andrew J.

White, Robert D.

Manno, Vincent P.

Rogers, Chris.

Anjur, Sriram.

Moinpour, Mansour.

2008.

Description
  • Micromachined structures with diameters ranging from 50 — 100 μm have been applied to the measurement of the microscale shearing forces present at the wafer-pad interface during chemical mechanical polishing (CMP) The structures are 80 μm high poly-dimethyl-siloxane posts with bending stiffnesses ranging from 1.6 to 14 μN/μm. The structures were polished using a stiff, ungrooved pad and 3 wt% fume... read more
This object is in collection Subject Permanent URL Citation
  • Gauthier, D., Mueller, A., White, R., Manno, V., Rogers, C., Hooper, D., . . . Moinpour, M. (2008). Micromachined Lateral Force Sensors for Characterization of Microscale Surface Forces During Chemical Mechanical Polishing. MRS Proceedings, 1085. doi:10.1557/PROC-1085-T05-11.
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wm118106m
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