%0 PDF %T An In-Situ Microcroaxial Fabrication and Attachment Strategy %A Torres, Daniela. %D 2018-06-04T10:04:04.934-04:00 %8 2018-06-04 %R http://localhost/files/rj430g66p %X Abstract: Micro-coaxial cables (MCCs), with an outer diameter of 100 μm or less, enable a new microelectronics packaging platform that will reduce the time required to design and fabricate complex multi-chip microelectronic assemblies. Low-inductance MCCs for power distribution and 30-75 Ω MCCs for signal distribution, eliminate the need for lengthy simulations and fabrication processes, as in board design of photo-lithographically patterned microchips, because each individually shielded MCC provides sufficient isolation to prevent electro-magnetic interference (EMI) and crosstalk. The in-situ fabrication method presented here utilizes only conventional wire bonding and microfabrication techniques, providing a high-feasibility path toward a new interconnect paradigm based on MCCs. Each cable measured consists of a 25.4 μm gold bond wire coated first with a dielectric and then a 5.0 μm thick gold shield. For power distribution, the dielectrics evaluated are 1.0 μm thick Parylene C dielectric and 100 nm thick HfO2. Their characteristic impedances are measured to be 3.2-5.9 Ω and 0.11-0.18 Ω, respectively. A third MCC, appropriate for signals, has a 38 μm thick Parylene C dielectric and a characteristic impedance of 39-68 Ω. For a wire pitch of 0.51 mm cross-talk is -62 dB at 1 GHz for micro-coax. Cross-talk increases to -30 dB at 26.5 GHz.; Thesis (M.S.)--Tufts University, 2018.; Submitted to the Dept. of Mechanical Engineering.; Advisors: Robert White, and Caprice Gray.; Committee: Marc Hodes.; Keywords: Packaging, Electrical engineering, and Mechanical engineering. %[ 2022-10-12 %9 Text %~ Tufts Digital Library %W Institution