In-Situ Investigation of Wafer-Slurry-Pad Interactions during CMP.

Braun, N.

Gray, Caprice.

Mueller, Andrew J.

Vlahakis, James.

Gauthier, Douglas.

Manno, Vincent P.

Rogers, Chris.

White, Robert D.

Anjur, Sriram.

Moinpour, Mansour.

2007.

Description
  • The objective of this project is to acquire in-situ data during chemical mechanical planarization (CMP) including slurry film thickness and flow, wafer-pad contact, wafer-scale friction, and small-scale shear force measurements. The unifying project goal is to utilize a consistent set of experimental data to develop better physical understanding of material removal rate (MRR) and polish quality du... read more
This object is in collection Creator department Subject Permanent URL Citation
  • Braun, N., Caprice Gray, Barry Trimmer, Andrew J. Mueller, et. al. "In-Situ Investigation of Wafer-Slurry-Pad Interactions during CMP." 2007 International Conference on Planarization / CMP Technology (ICPT) (October 25-27, 2007). http://ieeexplore.ieee.org/document/5760402/.
ID:
m900p629w
To Cite:
DCA Citation Guide    EndNote
Usage:
Detailed Rights