A Thermal Demonstration of High Density Processor Packages.
Lewis, Peter H.
2014
- Abstract: As technology continues to miniaturize processor chips, the thermal load of the electronics has become a primary hindrance in the development and implementation of more powerful chips. An internal effort by Draper Laboratory has been made in order to characterize the effect of their high density packaging method on the thermal load. The following thesis provides a thermal characterization ... read moreof Draper Laboratory’s integrated Ultra-High Density (iUHD) material, an extreme miniaturization packaging method. The thesis covers the thermal effects of multiple layers of the iUHD material, the presence of metal traces, the isolation of the testing module’s components and the stacking of multiple modules. The thermal contribution of a layer of the iUHD material was determined to be 0.067-0.077 oC/W depending on the number of layers and the presence of metal traces. The thermal resistance contribution of the components of the second layer of the stack was determined to be 0.24 oC/W. The isolation of module components was successful and locally raised the temperature in the isolated areas by 4-5 times.read less
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- bz60d731d
- Component ID:
- tufts:sd.0000049
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