A Thermal Demonstration of High Density Processor Packages.

Lewis, Peter H.
2014

Abstract: As technology continues to miniaturize processor chips, the thermal load of the electronics has become a primary hindrance in the development and implementation of more powerful chips. An internal effort by Draper Laboratory has been made in order to characterize the effect of their high density packaging method on the thermal load. The following thesis provides a thermal characterizatio... read more

This object is in collection:
Undergraduate Honors Theses
Subjects
Heat--Transmission.
Microelectronics--Materials--Thermal properties.
Tufts University. Department of Mechanical Engineering.
Genre
Permanent URL
http://hdl.handle.net/10427/000511
Original publication
ID: tufts:sd.0000049
To Cite: DCA Citation Guide
Usage: Detailed Rights