Low Profile Packaging for MEMS Aero-Acoustic Sensors.

Burns, John.
2017-04-19T12:48:55.899Z

Abstract: This thesis explores both a semi-automated conductive ink process and modifications to Draper Laboratory's i-UHD (Integrated - Ultra High Density) process for packaging MEMS devices. These methods are applied to packaging MEMS acoustic sensors for wind tunnel testing. The primary advantage of these methods is a reduction in surface topology between the package and the integrated MEMS sen... read more

Subjects
Tufts University. Department of Mechanical Engineering.
Permanent URL
http://hdl.handle.net/10427/011618
ID: tufts:21092
To Cite: DCA Citation Guide