Low Profile Packaging for MEMS Aero-Acoustic Sensors.Burns, John.
Abstract: This thesis explores both a semi-automated conductive ink process and modifications to Draper Laboratory's i-UHD (Integrated - Ultra High Density) process for packaging MEMS devices. These methods are applied to packaging MEMS acoustic sensors for wind tunnel testing. The primary advantage of these methods is a reduction in surface topology between the package and the integrated MEMS sen... read more
- Tufts University. Department of Mechanical Engineering.
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