Enhanced Heat Sink Performance Utilizing Capillary-Driven Evaporation.

Mueller, Stuart.
2017-04-18T14:01:52.512Z

Abstract: Heat sinks with the same form factor, but lower thermal resistance than currently available are desirable in many applications. For example, they would benefit the electronics packaging industry by accommodating increased heat dissipation in reduced form factors. An enhanced longitudinally-finned heat sink that exploits evaporative cooling to significantly reduce its thermal resistance w... read more

Subjects
Tufts University. Department of Mechanical Engineering.
Permanent URL
http://hdl.handle.net/10427/011464
ID: tufts:20939
To Cite: DCA Citation Guide